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MAX6713S EXS Rev. A
RELIABILITY REPORT FOR MAX6713S EXS PLASTIC ENCAPSULATED DEVICES
December 17, 2001
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX6713S successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description The MAX6713S is a microprocessor (P) supervisory circuit used to monitor the power supplies in P and digital systems. It provides excellent circuit reliability and low cost by eliminating external components and adjustments when used with +5.0V, +3.3V, +3.0V, or +2.5V-powered circuits. It also provides a debounced manual reset input. This circuit asserts a reset signal whenever the VCC supply voltage declines below a preset threshold or whenever manual reset is asserted. Reset remains asserted for at least 140ms after VCC has risen above the reset threshold or when manual reset is asserted. Reset thresholds suitable for operation with a variety of supply voltages are available. The MAX6713 has an open-drain output stage. The MAX6713S's open-drain RESET-bar output requires a pull-up resistor that can be connected to a voltage higher than VCC. The MAX6713S has an active -low reset output . The reset comparator is designed to ignore fast transients on VCC, and the outputs are guaranteed to be in the correct logic state for VCC down to 1V. Low supply current makes the MAX6713S ideal for use in portable equipment. Thia device ia available in a 4-pin SC70 package.
B. Absolute Maximum Ratings Item VCC to Gnd /RESETOUT to Gnd Operating Temp Range Storage Temp Range Lead Temp Range (soldering, 10s) Power Dissipation 4-Pin SC70 Derates above +70C 4-Pin SC70 Rating -0.3V to +6V -0.3V to +6V -400C to +1250C -650C to +1500C +3000C 1245mW 3.1mW/C
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: 4-Pin SC70 Microprocessor Reset Circuits with Manual Reset Input S8 380 Oregon, USA Malaysia April, 2001
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. 4-Lead SC70 Alloy 42 Solder Plate Non-Conductive Expoxy Gold (1.0 mil dia.) Epoxy with silica filler Buildsheet # 05-1601-0100 Class UL94-V0
Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 30 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Silicon None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord Bryan Preeshl Kenneth Huening
(Reliablity Lab Manager) (Executive Director of QA) (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 192 x 4389 x 180 x 2 (Chi square value for MTTF upper limit)
Thermal acceleration factor assuming a 0.8eV activation energy = 6.79 x 10-9 = 6.79 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. The following Burn-In Schematic (Spec. #06-5033) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1L). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The MS42-3 die type has been found to have all pins able to withstand a transient pulse of 2500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 200mA.
Table 1 Reliability Evaluation Test Results MAX6713SSEXS TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
160
0
DC Parameters & functionality
100
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters 77 0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the SC70 package. Note 2: Generic package/process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
b.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
TERMINAL D
Mil Std 883D Method 3015.7 Notice 8
ONCE PER SOCKET
ONCE PER BOARD
100 OHMS
+5V 700uA
1 2 3 4
8 7 6 5
0.1uF
8-DIP
DEVICES: MAX 941/809/810/823/824/825/803 MAX 6381/6835 MAX. EXPECTED CURRENT = 700uA AND 15uA
DOCUMENT I.D. 06-5033 REVISION E
DRAWN BY: HAK TAN NOTES: 15 uA FOR MAX 6381
MAXIM
TITLE: BI
Circuit (MAX 6381/803/809/810/823/824/825/941/6835)
PAGE
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